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revision 1.1 atp i ndustrial gra de cfast specification atp industrial grade cfast card specification revision 1.1 y y o o u u r r u u l l t t i i m m a a t t e e m m e e m m o o r r y y s s o o l l u u t t i i o o n n ! ! 1 atp confidential & proprietary
revision 1.1 atp i ndustrial gra de cfast specification disclaimer: a tp electronics inc . shall not be liable for any errors or omissions that may appear in this document, and disclaims responsibility for any consequences res ulting from the use of the information set forth herein. the information in this manual is subject to change without notice. atp general policy does not recommend the use of its products in life support applications where in a failure or malfunction of t he product may directly threaten life or injury. all parts of the atp documentation are protected by copyright law and all rights are reserved. this documentation may not, in whole or in part, be copied, photocopied, reproduced, translated, or reduced to any electronic medium or machine - readable form without prior consent, in writing, from atp corporation. the information set forth in this document is considered to be ?proprietary? and ?confidential? property owned by atp. revision history date versio n changes compared to previous issue mar.22nd, 2012 0.1 - preliminary version mar.28th, 2012 0.2 - update s.m.a.r.t. tool screenshot may 31st, 2012 1.0 - official released version jul. 5 th , 2012 1.1 - add tbw sequential write information - add ncq/tri m command information y y o o u u r r u u l l t t i i m m a a t t e e m m e e m m o o r r y y s s o o l l u u t t i i o o n n ! ! 2 atp confidential & proprietary
revision 1.1 atp i ndustrial gra de cfast specification table of contents 1 atp industrial grade c fast card overview ....................................................................................... 4 1.1 atp p roduct a vailability ................................................................................................................................. 4 1.2 i ntroduction ........................................................................................................................................................ 5 1.3 a pplication ........................................................................................................................................................... 5 1.4 m ain f eatures ...................................................................................................................................................... 6 2 product specificatio n ...................................................................................................................................... 7 2.1 s upply v oltage .................................................................................................................................................... 7 2.2 c urrent c onsumptio n ......................................................................................................................................... 7 2.3 e nvironment s pecification ................................................................................................................................ 7 2.4 r eliability ............................................................................................................................................................ 8 2.5 cf ast c ard c apacity .......................................................................................................................................... 8 2.6 p erformance ........................................................................................................................................................ 9 2.6.1 iops ................................................................................................................................................................... 9 2.6.2 read/write performance ................................................................................................................................... 9 2.7 c ertification and com pliance ........................................................................................................................... 9 2.8 g lobal w ear l eveling - l onger l ife e xpectancy ........................................................................................ 10 2.9 s atic d ata r efresh t echnology ? e nsure d ata i ntegrity .......................................................................... 10 2.10 atp p ower p rotector ? b uilt - in p ower f ailure d ata p rotection ........................................................... 10 2.11 ncq/trim c ommand s upport ......................................................................................................................... 11 2.12 p hysical d imension s pecification ................................................................................................................... 12 2.13 m echanical f o rm f actor (u nits in mm) ....................................................................................................... 12 3 electrical interface ..................................................................................................................................... 13 3.1 p in a ssignments and p in t ype .......................................................................................................................... 13 3.2 e lectrical d escription ..................................................................................................................................... 14 3.3 e lectrical s pecification .................................................................................................................................. 15 3.3.1 maximum input current ................................................................................................................................... 15 4 ata command descript ion ............................................................................................................................ 17 4.1 ata c ommand s et ............................................................................................................................................. 17 4.2 i dentify d evice d a ta ........................................................................................................................................ 18 5 s . m . a . r . t . function .............................................................................................................................................. 20 5.1 s . m . a . r . t . f eature ............................................................................................................................................ 20 5.2 s . m . a . r . t . f eature r egister v alues .............................................................................................................. 20 5.3 s . m . a . r . t . d ata s tructure .............................................................................................................................. 21 5.4 atp s.m.a.r.t. t ool ......................................................................................................................................... 22 y y o o u u r r u u l l t t i i m m a a t t e e m m e e m m o o r r y y s s o o l l u u t t i i o o n n ! ! 3 atp confidential & proprietary
revision 1.1 atp i ndustrial gra de cfast specification 1 at p industrial grade c fast card overview 1.1 atp product availability figure 1 - 1 : atp product availability table 1 - 1: capacities atp p/n capacity af2gcsi - oaaxp 2gb af4gcsi - oaaxp 4gb af8gcsi - oaaxp 8gb af16gcsi - oaaxp 16gb af32gcsi - oaaxp 32gb note : ? p ? stands for powerprotector feature y y o o u u r r u u l l t t i i m m a a t t e e m m e e m m o o r r y y s s o o l l u u t t i i o o n n ! ! 4 atp confidential & proprietary
revision 1.1 atp i ndustrial gra de cfast specification 1.2 introduction wi th a form factor similar to compactflash c ard and a faster and more advanced sata interface, atp industrial grade cfast card is the ideal replacement of compactflash card. atp ind ustrial grad e cfast card is fully compliant with cfa cfast specifica tion version 1.1 with a sata 3gb /s interface. the cfast c ard contains a 24- pin connector co nsisting of a sata compatible 7 - pin signal connector and a 17- pin power and control connector. co mpare d to traditional compactflash card with ata/ide interface, atp cfast card features high - speed data transfer capability of up to 142mb/s read speed, and a 112mb/s write speed. by utilizing slc nand flash memory and globa l wear leveling technology, the atp industrial grade c fast card s ha ve enhanced endurance level s and longer product life span s . the produce line implements ecc (error correction code) and staticdatarefresh technolog ies , which correct and monitor the error bit levels to ensure data integr ity . i ncorporat ing the s.m.a.r.t. (self - monitoring, analysis, and reporting technology) function , users are able to monitor various parameters of endurance and reliability . this information helps to predict storage failure with preventative action. atp pow erprotector technology guarantees reliable controller and lasting nand flash operation with a back power circuit during a power outage. the standalone design of powerprotector ensures a sufficient amount of backup power during any power abnormalities su ch as unstable voltages . 1.3 application the new cfast specification, a combination of cf and ata serial transport (ast), is recommended as new boot and storage device in embedded and industrial markets . these markets include military/ aerospace , autom ation , marine navigation, embedded system, telecommunication equipment / networking and medical equipment where mission - critical data requires the highest level of reliability, durability, and data integrity . y y o o u u r r u u l l t t i i m m a a t t e e m m e e m m o o r r y y s s o o l l u u t t i i o o n n ! ! 5 atp confidential & proprietary
revision 1.1 atp i ndustrial gra de cfast specification 1.4 main feature s ? single - level - cell (slc) nand flash ? h ost interface: ? compliant with sata specification 2.6 and cf ast specification 1.1 ? sata 3.0gb/s interface ? 24- pin connector : 7- pin signal connector and 17- pin power and control connector ? high performance: ? sequential read up to 142 mb/s ? sequential write up t o 112mb/s ? capacity: 2g b to 32gb ? industrial grade operating temp. : - 40 o c to 85 o c ? endurance: ? enhanced endurance by global w ear l eveling algorithm and bad block management ? bch - ecc engine can correct up to 40 bit errors per 1,024 bytes data ? tbw (total bytes written): up to 640 terabyte random write (32gb cfast card) ? staticdatarefresh technology to ens ure data integrity in read operations. ? atp powerprotector, built - in hardware power - down data protection ? s.m.a.r.t. function support for life time monito r ? support ncq/ trim command ( rere rver or y y o o u u r r u u l l t t i i m m a a t t e e m m e e m m o o r r y y s s o o l l u u t t i i o o n n ! ! 6 atp confidential & proprietary
revision 1.1 atp i ndustrial gra de cfast specification 2 product specification 2.1 supply voltage table 2.1 supply voltage parameter symbol min typ max unit supply voltage vcc 3.15 3.3 3.45 v 2.2 current consumption table 2.2 current consumpti on current consumption 3.3v unit read (typ/max) 270 / 31 0 ma write (typ/max) 330 / 41 0 ma idle 194 ma note: the value is measured based on 32gbyte cfast card at 25 o c and normal supply voltage . the consumption of each cfast card may be different and the maximum value is for reference purpose. 2.3 environment specification table 2 - 3 : environment specification type measurement temperature operat ion - 40 o c to + 85 o c non - operat ion - 40 o c to + 85 o c humidity storage + 40 oc , 93% rh / 500hrs + 85oc, 8 5% rh / 1 000hrs random vibration test ( jesd22 - b103 ) non - operat ion 20g peak, 20~ 2000hz shock test ( jesd22 - b110 ) non - operat ion 1500g, 0.5ms duration, half sine wave uv light exposure test (iso 7816 - 1) non - operation 254nm, 15ws/cm2 drop test non - operation 120cm/ free fall/9 times esd ( iec 61000 - 4 - 2 ) non - operation non - contact pad (co upling plane discharge) +/ - 8kv non - contact pad (air discharge) +/ - 15kv y y o o u u r r u u l l t t i i m m a a t t e e m m e e m m o o r r y y s s o o l l u u t t i i o o n n ! ! 7 atp confidential & proprietary
revision 1.1 atp i ndustrial gra de cfast specification 2.4 reliability table 2 - 4 : reliability type measurement number of insertions 10,000 minimum endurance glob al wear leveling algorithm slc block endurance : 100,000 p/e cycles cfast endurance tbw (total bytes written) 2gb 40 terabyte random write 80 terabyte sequential write 4gb 80 terabyte random write 160 terabyte sequential write 8gb 160 terabyte random write 320 terabyte sequential write 16gb 320 terabyte random write 640 terabyte sequential 32gb 64 0 terabyte random write 1,280 terabyte sequential write mtbf (25 ) >5,000,000 hours note: endurance for flash product s can be predicted based on the usage conditions applied to the device, the internal nand flash cycles, the write amplification factor, and the wear leveling efficiency of the flash devices. 2.5 cfast card capacity table 2 - 5: cfast card capacity product capacity lba (sectors) physical c a pacity (bytes) 2gb 3864576 1,978,195,968 4gb 7839744 4,013,678,592 8gb 15458304 7,914,332,160 16gb 30916608 15,829,303,296 32gb 61849600 31,666,995,200 y y o o u u r r u u l l t t i i m m a a t t e e m m e e m m o o r r y y s s o o l l u u t t i i o o n n ! ! 8 atp confidential & proprietary
revision 1.1 atp i ndustrial gra de cfast specification 2.6 performance 2.6.1 iops table 2 - 6 1 : iops type value 4k random read iops (32gb) 4,609 iops notes: iops: input / output operations per second 2.6.2 read/write performance table 2 - 6 2 : read/write performance model p/n seq . read ( k b/s) seq . write ( k b/s) random read (kb/s) random write (kb/s) af2gcsi - oaaxp 31950 14808 30117 6361 af4gcsi - oaaxp 63900 30095 56888 9426 af8gcsi - oaaxp 127601 69861 90319 13865 af16gcsi - oaaxp 137912 113777 93515 18584 af32gcsi - oaaxp 141485 111455 90319 18980 note: tested by hdbench 3.40 beta6 with 40mb file size. the performance may vary based on different testing environ ments. 2.7 certification and compliance table 2 - 7 : certification table mark/approval doc u mentation certification the ce marking (also known as ce mark) is a mandatory conformance mark on many products placed on the single market in the european economic area (eea). the ce marking certifies that a product has met eu consumer safety, health or environmental requirements. ce stands for conformit europenne, "european conformity" in french. yes fcc part 15 class b was used for evol ution of united states (us) emission standards for commercial electronic products, the united states (us) covers all types of unintentional radiators under subparts a and b (sections 15.1 through 15.199) of fcc 47 cfr part 15, usually called just fcc part 15 yes rohs is the acronym for restriction of hazardous substances. rohs, also known as directive 2002/95/ec, originated in the european union and restricts the use of specific hazardous materials found in electrical and electronic products. all applicable products in the eu market after july 1, 2006 must pass rohs compliance. for the complete directive, see directive 2002/95/ec of the european parliament . yes y y o o u u r r u u l l t t i i m m a a t t e e m m e e m m o o r r y y s s o o l l u u t t i i o o n n ! ! 9 atp confidential & proprietary
revision 1.1 atp i ndustrial gra de cfast specification 2.8 global wear leveling - longer life expectancy the program / erase cycle of each sector/page/block is finite . writing constantly on the same spot will cause the flash to wear out quickly. furthermore, bit errors are not proportioned to p/e cycles; sudden death may occur when the block is close to its p/e cycle limit. then unrecoverable bit errors will cause fata l data loss (especially for system data or fat). global w ear l eveling algorithm evenly distributes the p/e cycles of each block to minimize the possibility of one block exceeding its max p/e cycles before the rest. in return, the life expectancy of memor y storage device is prolonged and the chance/occurrence of unrecoverable bit errors could be reduced. 2.9 saticda tarefresh technology ? en sure d ata integrity over time the error bits accumulate to the threshold in the flash memory cell and eventually become uncorrectable despite using the ecc engine. in the traditional handling method, the data is moved to a different location in the flash memory; despite the corrupted data is beyond repair ed before the transition. to pre vent data corruption, atp industrial grade cf ast card monitors the error bit levels in each read operation . w hen it reaches the preset threshold value , staticdatarefresh is ac tivate d by erasing and re - programming the d ata into another block . after the re - programming operation is completed, t he controller reads the data and compares the data/parity to ensure data integrity. 2.10 atp powerprotector ? built - in power failure data protection atp powerprotector technology ensures a sufficient amount of reserve power during any power abnormalities s uch as unstable voltages and power outages. powerprotector? s patent pending technology is a stand alone hardware design that does not require specific controllers or customized firmware. this feature provides greater flexibility during the design of a sm aller form factor such as c fast cards . y y o o u u r r u u l l t t i i m m a a t t e e m m e e m m o o r r y y s s o o l l u u t t i i o o n n ! ! 10 atp confidential & proprietary
revision 1.1 atp i ndustrial gra de cfast specification d uring a sudden power failure, t he drive then draws power from powerprotector?s solid state capacitors for reserve power, which guarantee s reliable drive operations. the solid state capacitors allow the flash to fini sh processing the last command or data. supercap , the traditional power protection design, is well known for its sensitivity to temperature change and has a tendency of losing its capacitance and functionality at extreme temperatures. the average life sp an of supercap is less than two years; the capacitance will degrade over time and eventually fail to perform. atp powerprotector surpasses the natural limitations of supercap designs by support ing wide temperature and an average life span of over five ye ars without capacitance degradation . powerprotector offers an advanced level of protection ensuring that data integrity is not compromised during a power failure scenario, and preserves critical data in mission critical applications. 2.11 ncq/trim command s upport ncq (native command queuing) is to o ptimize the order in which received read and write commands are executed. under certain circumstances, it could e nhance performance up to 30% . trim command is to a llow an operating system to inform a sata device which blocks of data are no longer considered in use and can be wiped internally. the result is the sata device will have more free space enabling lower write amplification and higher performance. it enables garbage collection, which prevent s performance from slo wing down due to invalid blocks after using for a period of time. ncq and trim c ommand require os/hw/driver support from host device. y y o o u u r r u u l l t t i i m m a a t t e e m m e e m m o o r r y y s s o o l l u u t t i i o o n n ! ! 11 atp confidential & proprietary
revision 1.1 atp i ndustrial gra de cfast specification 2.12 physical dimension specification table 2 - 1 2 : physical specifications type measurement type i length 36.4 0.15 mm width 42.80 0.10 mm thickness 3.6 mm maximum weight 9.0 g typical 2.13 mechanical form f actor (unit s in mm) figure 2 - 1 3 : atp cfast physical dimensions y y o o u u r r u u l l t t i i m m a a t t e e m m e e m m o o r r y y s s o o l l u u t t i i o o n n ! ! 12 atp confidential & proprietary
revision 1.1 atp i ndustrial gra de cfast specification 3 e lectrical i nterface 3.1 pin assignments and pin type the signal/pin a ssignm ents are listed in table 3- 1 : pin assignments and pin type low active signals have a ? - ? prefix. pin types are input, output or input/output. section 3 .3 defines the dc characteristics for all input and output type structures. table 3 - 1: pin assignments and pin type number segment name type description mate sequence s1 sata sgnd signal gnd ground for signal integrity 1 st s2 sata a+ sata differential signal pair a 2 nd s3 sata a - sata differential 2 nd s4 sata sgnd signal gnd g round for signal integrity 1 st s5 sata b - sata differential signal pair b 2 nd s6 sata b+ sata differential 2 nd s7 sata sgnd signal gnd ground for signal integrity 1 st key key pc1 pwr/ctl cdi cmos input card detect i n 3 rd pc2 pwr/ctl gnd device gnd 1 st pc3 pwr/ctl tbd tbd 2 nd pc4 pwr/ctl tbd tbd 2 nd pc5 pwr/ctl tbd tbd 2 nd pc6 pwr/ctl tbd tbd 2 nd pc7 pwr/ctl gnd device gnd 1 st pc8 pwr/ctl led1 led output led output 2 nd pc9 pwr/ctl led2 led output led output 2 nd pc10 pwr/ctl io1 cmos input/output reserved input/output 2 nd pc11 pwr/ctl io2 cmos input/output reserved input/output 2 nd pc12 pwr/ctl io3 cmos input/output reserved input/output 2 nd pc13 pwr/ctl pwr 3.3v device power (3.3v) 2 nd pc14 pwr/ctl pwr 3.3v device power (3.3v) 2 nd pc15 pwr/ctl pgnd device gnd device ground 1 st pc16 pwr/ctl pgnd device gnd device ground 1 st pc17 pwr/ctl cdo cmos output card detect ou t 3 rd y y o o u u r r u u l l t t i i m m a a t t e e m m e e m m o o r r y y s s o o l l u u t t i i o o n n ! ! 13 atp confidential & proprietary
revision 1.1 atp i ndustrial gra de cfast specification 3.2 electrical description table 3- 2 : signal description describes the i/o signals. signals whose source is in the host are designated as inputs while signals that the cfast card sources are outputs. table 3 - 2: signal description description of sat a segment pins name type description sgnd signal ground these are intended to provide isolation for the high speed differential signals. a+, a - , b+, b - sata differential the functionality and electrical characteristics of these pins are defined i n the sata reference description of pwr/ctl segment pins name type description cdi cmos input this signal is driven by the cfast host, and shall be sampled by the cfast device this pin shall be shorted on a cfast device to cdo. this signal and cdo provide a mechanism for a cfast host to detect that a cfast device has been fully inserted, and so that power can be applied safely. the host may drive, and the device may sample, this pin to provide signaling to enable cfast power management sleep state. cdo cmos output this pin shall be shorted on the cfast device to cdi. it is effectively driven by cdi. led1 led output led output led2 led output led output io1 cmos input/output unassigned input/output pin io2 cmos input/output unassi gned input/output pin io3 cmos input/output unassigned input/output pin y y o o u u r r u u l l t t i i m m a a t t e e m m e e m m o o r r y y s s o o l l u u t t i i o o n n ! ! 14 atp confidential & proprietary
revision 1.1 atp i ndustrial gra de cfast specification 3.3 electrical specification the tables in this section define all d.c. characteristics for the cfast card series. unless otherwise stated, conditions are: vcc = 3.3v 5% ta = - 40 c to 85 c table 3 - 3: absolute maximum conditions parameter symbol conditions input power vcc - 0.3v min. to 3.6 v max. voltage on any pin except vcc with respect to gnd. v - 0.5vmin. to vcc + 0.5v max. the card does not need t o operate, or to meet any operating specifications outside its operating conditions. application of absolute maximum conditions shall not damage the card. 3.3.1 maximum input current table 3 - 3 1 : maximum input current power level voltage temperature during te st average current range (active) average current range (partial) average current range (slumber) average current range (physlp) 0 3.3v1% at 23c1c 0 ? 500ma 0 ? 500ma 0- 250ma 0- 20ma 1 3.3v1% at 23c1c 0 ? 1200ma 0 ? 1200ma 0- 250ma 0- 20ma to comply with this specification, current requirements shall not exceed the maximum limit. for cfast cards, two power levels are defined. power level 0 has a maximum average current of 500 ma, while power level 1 has an increased maximum current of 1200 ma for 3.3v. if the cfast card does not support the cfa feature set, the card shall stay within the power envelope of power level 1. cfast cards shall operate within the specifications for power level 0 at power on and after reset. cfast cards sha ll also support ata identify device and set features commands in power level 0. this requirement allows the host device to determine the cfast card?s capabilities and which power levels are supported. the possibilities are: y y o o u u r r u u l l t t i i m m a a t t e e m m e e m m o o r r y y s s o o l l u u t t i i o o n n ! ! 15 atp confidential & proprietary
revision 1.1 atp i ndustrial gra de cfast specification ? power level 0, ? power level 1, ? power level 0 and power level 1. the host shall use the set features command to set the desired power level to the card if it is compatible with it, or reject the cfast card. an example of a cfast card using both po wer level 0 and power level 1 is a flash memory card supporting both power levels. when set by the host to power level 0 (default) it shall have lower performance than when it is set to power level 1, but shall not exceed the power level 0 current consumpt ion. y y o o u u r r u u l l t t i i m m a a t t e e m m e e m m o o r r y y s s o o l l u u t t i i o o n n ! ! 16 atp confidential & proprietary
revision 1.1 atp i ndustrial gra de cfast specification 4 ata command description 4.1 ata command set table 4 - 1 . ata command set command code fr sc sn cy dh check power mode e5h or 98h - - - - d erase sector(s) (cfa) c0h y y y y - execute drive diagnostic 90h - - - - - fl ush cache e7h - - - - y flush cache ext eah - - - - y identify drive ech - - - - d idle e3h - y - - d idle immediate e1h - - - - d initialize drive parameters 91h - y - - y read dma c8h or c9h - y y y y read dma ext 25h - y y y y read fp dma queued 60h y y y y y read log ext 2fh y y y y y read multiple c4h - y y y y read multiple ext 29h - y y y y read sector(s) 20h or 21h - y y y y read sector(s) ext 24h - y y y y read verify sector(s) 40h or 41 z - y y y y read verify sector(s) ext 42h - y y y y recalibrate 1xh - - - - d security disable password f6h - - - - d security erase prepare f3h - - - - d security erase unit f4h - - - - d security freeze lock f5h - - - - d security set password f1h - - - - d security unlock f2h - - - - d seek 7xh - - y y y set features efh y - - - d set multiple mode c6h - y - - d set sleep mode e6h - - - - d smart b0h y - - y d stand by e2h - - - - d stand by immediate e0h - - - - d write dma cah or cbh - y y y y write dma ext 35h - y y y y write dma fua ext 3dh - y y y y write fpdma queued 61h y y y y y write multiple c5h - y y y y write multiple ext 39h - y y y y write multiple fua ext ceh - y y y y write sector(s) 30h or 31h - y y y y write sector(s) ext 34h - y y y y y y o o u u r r u u l l t t i i m m a a t t e e m m e e m m o o r r y y s s o o l l u u t t i i o o n n ! ! 17 atp confidential & proprietary
revision 1.1 atp i ndustrial gra de cfast specification 4.2 identify dev ice data table 4 - 2 identify device data y y o o u u r r u u l l t t i i m m a a t t e e m m e e m m o o r r y y s s o o l l u u t t i i o o n n ! ! 18 atp confidential & proprietary
revision 1.1 atp i ndustrial gra de cfast specification y y o o u u r r u u l l t t i i m m a a t t e e m m e e m m o o r r y y s s o o l l u u t t i i o o n n ! ! 19 atp confidential & proprietary
revision 1.1 atp i ndustrial gra de cfast specification 5 s .m .a .r.t . function 5.1 s. m . a . r . t . feature self - monitoring analysis and reporting technology (s.m.a.r.t.) is used to protect the user from unscheduled downtime. by monitoring and storing critical performance and calibration parameters, s .m .a .r .t . feature set devices attempt to predict the likelihood of near - term degradation or fault condition. informing the host system of a negative reliability condition allows the host system to warn the user of the impending ri sk of a data loss and advise the user of appropriate action. 5.2 s. m . a . r . t . feature register values in order to select a subcommand the host must write the subcommand code to the device's features register before issuing the s .m .a .r .t . function set comma nd. the subcommands are listed below. table 5 - 2 : s . m . a . r . t . feature register values n ote: if the reserved size is below the threshold, the status can be read from the cylinder register using the return status command (dah) y y o o u u r r u u l l t t i i m m a a t t e e m m e e m m o o r r y y s s o o l l u u t t i i o o n n ! ! 20 atp confidential & proprietary
revision 1.1 atp i ndustrial gra de cfast specification 5.3 s. m . a . r . t . data structure the following 512 bytes make up the device s.m.a.r.t. data structure. users can obtain the data using the ?read data? command (d0h). table 5 - 3 : s.m.a.r.t. data structure byte f/v description 0~1 x revision code 2~361 x vendor specific 362 v off - line data collection status 363 x self - test execution status byte 364~365 v total time in seconds to complete off - line data collection activity 366 x vendor specific 367 f off - line data collection capability 368~369 f s.m.a.r.t. capability 370 f error logging capability 7 - 1 reserved 0 1 = device error logging supported 371 x vendor specific 372 f short self - test routine recommended polling time(in minutes) 373 f extended self - test routine recommended polling time(in minutes) 374 f conveyance self - test routine recommended polling time(in minutes) 375~385 r reserved 386~395 f firmware version/date code 396~397 f reserved 398~399 v reserved 400~406 f controller 407~41 5 x vendor specific 416 f reserved 417 f program/write the strong page only 418~419 v number of spare block 420~423 v average erase count 424~510 x vendor specific 511 v data structure checksum notes: f=content (byte ) is fixed and does not change v=content (byte ) is variable and maybe change depending on the state of the device or the command executed by the device x= content ( byte) is vendor specific and maybe fixed or variable r= content ( byte ) is reserved and shall be zero y y o o u u r r u u l l t t i i m m a a t t e e m m e e m m o o r r y y s s o o l l u u t t i i o o n n ! ! 21 atp confidential & proprietary
revision 1.1 atp i ndustrial gra de cfast specification 5.4 atp s.m.a.r.t. tool atp provides s.m.a.r.t. tool for windows 2000/xp/vista/7 and linux, it can mo nitor the state of industrial grad cfast card , and the following picture shows s.m.a.r.t. tool operation. t his tool support s that users read spare and bad block information. users can thus evaluate drive health at run time and receive an early warning befo re the drive life ends. figure 5 - 4 : atp s.m.a.r.t. tool operation note: the s.m.a.r.t. tool version will be updated from time to time. please check with sales for the latest version. y y o o u u r r u u l l t t i i m m a a t t e e m m e e m m o o r r y y s s o o l l u u t t i i o o n n ! ! 22 atp confidential & proprietary
revision 1.1 atp i ndustrial gra de cfast specification atp electronics inc . 750 north mary ave. sunnyvale, ca 94085 usa flash@atpinc.com phone: +1 -408-732- 5000 ext. 5859 fax: +1 -408-732-5055 http://www.atpinc.com at p electronics taiwan, inc. 10f, no. 185, tiding blvd. sec. 2 neihu, taipei, taiwan 114 sales - apac@atpinc.com phone: +886 -2 -2659- 6368 fax: +886 -2 -2659-4982 http://www.atpinc.com atp electronics europe b.v . cor kstraat 46 rotterdam 3047 ac the netherlands sales - emea@atpinc.com phone: +31 (0) 88 287 0000 fax: +31 (0) 88 287 0099 http://www.atpinc.com atp electronics japan office #1007, 10f, 1 -8 - 4, kandasakuma - cho chiyoda - ku, 101- 0025, japan support - japan@atpinc.com http://www.atpinc.com atp electronics shangha , inc b102, #5 00 bibo rd. zhangjiang high - tech park,pudong, shanghai ,china sales@ cn. atpinc.com phone: +86 -21- 50802220 fax: +86 -21-50802219 http://www.atpinc.com y y o o u u r r u u l l t t i i m m a a t t e e m m e e m m o o r r y y s s o o l l u u t t i i o o n n ! ! 23 atp confidential & proprietary

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